Product Documentation
Virtuoso Technology Data SKILL Reference
Product Version IC23.1, June 2023

techGetPrGenViaParams

techGetPrGenViaParams(
d_techID 
t_viaSpecName
) 
=> l_genViaParams / nil

Description

Returns the parameters of all via specifications containing standard via definitions in the specified technology database. ASCII technology file location: viaSpecs section. Standard via definitions are defined in the standardViaDefs subsection of the viaDefs section.

For more information about the viaSpecs class of the technology file, see viaSpecs in Virtuoso Technology Data ASCII Files Reference. For more information about the viaDefs class of the technology file and standard via definitions, see viaDefs in Virtuoso Technology Data ASCII Files Reference.

Arguments

d_techID

The database identifier of the technology database.

t_viaSpecName

The name of the via specification.

Value Returned

l_genViaParams

A list containing the data defined for the specified via specification in the viaSpecs class and the standardViaDefs subclass of the viaDefs class in the specified technology database. The list has the following syntax:

( lt_cutLayer ( g_lowerPt g_upperPt g_xPitch g_yPitch n_resistance )
tx_layer1 t_dir1 ( n_minWidth n_maxWidth n_overhang n_metalOverHang ) lt_layer2 t_dir2 ( n_minWidth n_maxWidth n_overhang n_metalOverHang ) )

where,

  • tx_cutLayer is the name of the cut layer as specified in the standard via definition.
  • g_lowerPt is the lower left point of the left bottom cut.
  • g_upperPt is the upper right point of the left bottom cut.
  • n_xPitch is the distance between the centers of cuts in the x direction (cutSpacing in the x direction + cutWidth).
  • n_yPitch is the distance between the centers of cuts in the y direction (cutSpacing in the y direction + cutHeight).
  • n_resistance is resistancePerCut as specified in the standard via definition.
  • tx_layer1 is the bottom routing layer for the via as specified in the standard via definition.
  • t_dir1 is the preferred routing direction of the bottom layer.
  • n_minWidth1 is the minimum width, in user units, of the bottom layer.
  • n_maxWidth1 is the maximum width, in user units, of the bottom layer.

  • n_overhang1 is the minimum spacing between the contact cut and the outer edge of the via.
    overhang1 is always _NA_ unless there is only one standard via definition, in which case, it is equal to the layer1Enc width parameter in the standardViaDef subclass when the layer direction is horizontal or it is equal to the height parameter when the layer direction is vertical.
  • n_metalOverhang1 is always _NA_. tx_layer2 is the top routing layer for the via as specified in the standard via definition.
  • t_dir2 is the preferred routing direction of the top layer.
  • n_minWidth2 is the minimum width, in user units, of the top layer.
  • n_maxWidth2 is the maximum width, in user units, of the top layer.
  • n_overhang2 is the minimum spacing between the contact cut and the outer edge of the via.
    overhang2 is always _NA_ unless there is only one standard via definition, in which case, it is equal to the layer2Enc width parameter in the standardViaDef subclass when the layer direction is horizontal or it is equal to the height parameter when the layer direction is vertical.

nil

The technology database does not exist or the specified rule is not defined in the subclass.

Example

techGetPrGenViaParams(techID "viagen21") 
=> (via (.6 .6  1.2 1.2 _NA_)
 metal1 "horizontal" (.6 20.0 .6 .6)
 metal2 "vertical"   (.6 20.0 .6 .6))

Returns the parameters of all via specifications containing standard via definitions in the technology database identified by techID.


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