Cross-fabric extraction allows you to create a model across IC, package and board. It captures the full coupling between fabrics in a single 3D simulation. Each layer has its own models. The objective is to extract a model for the outer-most fabric, which is a board layout. Each fabric in the stack references the models of other fabrics placed within it.
To create a electromagnetic model for a cross fabric design:
- Ensure that the prerequisites are met:
- Each package and board fabric has a dielectric layer on top and bottom.
- The height of the balls and bumps for each abstract instance equal to or higher than the height of the solder mask.
- Open the outer-most fabric in VLS EXL and enable Co-Design mode.
- Following the bottom-up approach, open the layout of the lowest fabric and define a model using the required objects from this layout.
- Switch to the layer above the previous layer.
- Create a new model by selecting objects from this layer and adding a reference to the die abstracts to be included in the model.
- Similarly, create models for all fabrics up to the top layer by using references to the other die abstracts.
- Choose Simulation – Create and Edit to run simulation and create n-ports that are saved in an S-param touchstone file.
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