How to configure process setup for a package layout?

For a package layout, the process setup information is read from the technology file and loaded in Virtuoso. If you have imported the layout from Allegro, the settings are also imported. You can validate the settings as described below.

Layer Stackup

1. Choose RF - Module- Setup - Layer Stack Editor to open the Layer Stack Editor form.
2. Check the values of thickness, conductivity, and permittivity of each metal and dielectric layer.
3. If required, modify these settings and click OK.

Review the dielectric layer above and below the package layer. If needed, use the Add Layer command to add layer above and below it.

Related Topic: Layer Stack Editor 

BGA Balls and Flip Chip Bump Setup

1. Select a BGA or IC instance.
2. Choose RF - Module- Setup - Bump and Ball Editor to open the Bump and Ball Editor form.
3. Validate the settings.
4. If required, modify these settings and click OK.

Related Topic: Bump and Ball Settings Editor