Product Documentation
Virtuoso MultiTech Framework User Guide
Product Version IC23.1, November 2023

vrfExportLayoutSkill

vrfExportLayoutSkill(
g_cellViewId
t_frontPinLayer
t_backPinLayer
[ ?dieInterfaceType t_dieInterfaceType ]
[ ?includeUnconnectedBump g_includeUnconnectedBump ]
[ ?pinNumbering t_pinNumbering ]
[ ?pinNumberFile t_pinNumberFile ]
[ ?abstractLib t_abstractLib ]
[ ?attachSParam g_attachSParam ]
[ ?sParamView t_sParamView ]
[ ?modelFile t_modelFile ]
[ ?shortPinLib t_shortPinLib ]
[ ?shortPinCell t_shortPinCell ]
[ ?frontLabelLPP t_frontLabelLPP ]
[ ?backLabelLPP t_backLabelLPP ]
[ ?csvFileName t_csvFileName ]
[ ?areaTransferFile t_areaTransferFile ]
[ ?abstractViewCell t_exportNoBumpTerm ]
[ ?exportNoBumpTerm g_exportNoBumpTerm ]
[ ?deleteViewsBeforeExport g_deleteViewsBeforeExport ]
[ ?outputMode t_outputMode ]
)
=> t / nil

Description

Exports the die for IC layouts. The function supports both IO cell and Shape with overlapping label as Die Interface Type. It generates a package type library that contains abstract, Technology Independent Layout Pcells (TILPs), schematic, and symbol views. The abstract view is the base cellview for the Pcell generated layout, that is, TILP. The schematic is the wrapper schematic for the IC symbol. The symbol view is used to instantiate the generated die symbol in a package schematic.

Arguments

g_cellViewId

Cellview ID of the layout to be used for exporting the die.

t_frontPinLayer

Front pin layer-purpose pair.

t_backPinLayer

Back pin layer-purpose pair.

[ ?dieInterfaceType t_dieInterfaceType ]

The valid values are IO cell (default)and SHAPEANDLABEL.

[ ?includeUnconnectedBump g_includeUnconnectedBump ]

When set to t, the unconnected bumps are included in the exported abstract view. The valid values are t or nil (default).

[ ?pinNumbering t_pinNumbering ]

The valid values are "Use pin names as numbers" (default), "Use numbers as-is", or "Use numbers from file".

[ ?pinNumberFile t_pinNumberFile ]

The die text file containing pin numbers for the IO cells that are used in the IO cells-based layout or pin numbers for the labels to be used in the shape-based layout. The default value is "".

Example:

?pinNumberFile "./sampleFile"

[ ?abstractLib t_abstractLib ]

Name of the package library of the abstract cellview. The default value is "die_footprint".

[ ?attachSParam g_attachSParam ]

Specifies whether an s-parameter model needs to be generated. The default value is nil.

[ ?sParamView t_sParamView ]

Name of the s-parameter view. The default value is "sparamModel".

[ ?modelFile t_modelFile ]

Model file to be used for the s-parameter model creation. The default value is "".

[ ?shortPinLib t_shortPinLib ]

Library that contains the pin instance symbol for shorting multiple nets. The default value is "basic".

[ ?shortPinCell t_shortPinCell ]

Cell that contains the pin instance symbol for shorting multiple nets. The default value is "cds_thru".

[ ?frontLabelLPP t_frontLabelLPP ]

Front label layer-purpose pair required when exporting shape- based layout when die interface type is SHAPEANDLABEL. The default value is "".

[ ?backLabelLPP t_backLabelLPP ]

Back label layer-purpose pair. It needs to be specified for exporting shape-based layout when die interface type is SHAPEANDLABEL. The default value is "".

[ ?csvFileName t_csvFileName ]

A CSV file for customizing or updating the CDF parameters during the die export.

By default, a CSV file with the following essential columns is created:

footprintCellName,DEVICE_TYPE
Footprint CellName:,DEVICE_TYPE
<abstractViewCell> <abstractViewCell>

Example:

footprintCellName,DEVICE_TYPE,CDS_DEVICE_TYPE, altFootPrintCellNames, ASI_MODEL, PARENT_PART_TYPE, PARENT_PPT, PARENT_PPT_PART, PART_NAME

[ ?areaTransferFile t_areaTransferFile ]

An XML file that includes rules to add some additional shapes in an abstract view, such as logos. Cadence recommends that you use a non-conductor SIP_SHAPE_CLASS layer (such as COMPONENT GEOMETRY) as the target layer in the XML file instead of a conductor layer. SiP Layout Option does not support CONDUCTOR class shapes or clines in die symbols because their corresponding layer might change unpredictably when the die orientation or placement is modified in the stack.

The default value of the argument is "".

[ ?abstractViewCell t_abstractViewCell ]

The given name of the abstract cellview. By default, the original IC cellview and the abstract cellview have the same name.

[ ?exportNoBumpTerm g_exportNoBumpTerm ]

Includes the top-level IC layout terminals, which do not have the corresponding IO cells in the layout, while exporting the die. By default, the terminals that have corresponding IO cell implementation are exported during die export. This argument is set by exportNoBumpTerm.

[ ?deleteViewsBeforeExport g_deleteViewsBeforeExport ]

Deletes all the die export views of the specified cell in the specified library before exporting. This argument is set by deleteViewsBeforeExport.

[ ?outputMode t_outputMode ]

Specifies how views will be updated while exporting a die. Generate_All ensures that all views are created during die export. This argument is set by outputMode.

Value Returned

t

Die export is successful.

nil

Die export failed.

Examples

vrfExportLayoutSkill(
                 geGetEditCellView()
                 "Metal11 drawing"
                 ""
                 ?dieInterfaceType "IO cell" 
                 ?includeUnconnectedBump nil
                 ?pinNumbering "Use pin names as numbers"
                 ?pinNumberFile ""
                 ?abstractLib "die_footprint"
                 ?ecoMode nil
                 ?attachSParam nil
                 ?sParamView "sparamModel"
                 ?modelFile ""
                 ?shortPinLib  "basic"
                 ?shortPinCell "cds_thru"
                 ?frontLabelLPP ""
                 ?backLabelLPP ""
            ) 

The function exports die in the following two different flows.

Another example

vrfExportLayoutSkill(cv "Metal3 drawing" "" ?abstractLib "die_footprints1" ?areaTransferFile "./areaTxFile.xml")

Related Topics

Exporting Dies

exportNoBumpTerm

deleteViewsBeforeExport

outputMode


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