vrfExportLayoutSkill
vrfExportLayoutSkill(g_cellViewId t_frontPinLayer t_backPinLayer[?dieInterfaceTypet_dieInterfaceType] [?includeUnconnectedBumpg_includeUnconnectedBump] [?pinNumberingt_pinNumbering] [?pinNumberFilet_pinNumberFile] [?abstractLibt_abstractLib] [?attachSParamg_attachSParam] [?sParamViewt_sParamView] [?modelFilet_modelFile] [?shortPinLibt_shortPinLib] [?shortPinCellt_shortPinCell] [?frontLabelLPPt_frontLabelLPP] [?backLabelLPPt_backLabelLPP] [?csvFileNamet_csvFileName] [?areaTransferFilet_areaTransferFile] [?abstractViewCellt_exportNoBumpTerm] [?exportNoBumpTermg_exportNoBumpTerm] [?deleteViewsBeforeExportg_deleteViewsBeforeExport] [?outputModet_outputMode] ) => t / nil
Description
Exports the die for IC layouts. The function supports both IO cell and Shape with overlapping label as Die Interface Type. It generates a package type library that contains abstract, Technology Independent Layout Pcells (TILPs), schematic, and symbol views. The abstract view is the base cellview for the Pcell generated layout, that is, TILP. The schematic is the wrapper schematic for the IC symbol. The symbol view is used to instantiate the generated die symbol in a package schematic.
Arguments
Value Returned
Examples
vrfExportLayoutSkill(
geGetEditCellView()
"Metal11 drawing"
""
?dieInterfaceType "IO cell"
?includeUnconnectedBump nil
?pinNumbering "Use pin names as numbers"
?pinNumberFile ""
?abstractLib "die_footprint"
?ecoMode nil
?attachSParam nil
?sParamView "sparamModel"
?modelFile ""
?shortPinLib "basic"
?shortPinCell "cds_thru"
?frontLabelLPP ""
?backLabelLPP ""
)
The function exports die in the following two different flows.
-
IO Cell Based
IOvrfExportLayoutSkill(cv "M4 drawing" "" ?abstractLib "die_footprint" ?dieInterfaceType "IO cell")
Output:
Export Die Report (PA_BGA_FC_PKG_TOP/PAMODULE_BGA_FC_VRF/layout)
****************************************************************
Connected ioCells = 21
Front side ioCells = 21
Back side ioCells = 0
Did not look for unconnected ioCells.
**************************************************************** -
Shape Based
vrfExportLayoutSkill(cv "Metal3 drawing" "Metal1 drawing" ?pinNumberFile "pinNumPropAsNumber_new.txt" ?frontLabelLPP "Metal3 label" ?backLabelLPP "Metal1 label" ?dieInterfaceType "SHAPEANDLABEL")
Output:
Shape Based Export Die Report (design_45_sb/INVX1_45_0/layout)
****************************************************************
Labels with overlapping shapes:
Front Side: 3
Back Side: 2
Labels without overlapping shapes:
Front Side: 1
Back Side: 0
****************************************************************
vrfExportLayoutSkill(cv "Metal3 drawing" "" ?abstractLib "die_footprints1" ?areaTransferFile "./areaTxFile.xml")
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