Controls section

The new construct is fabricType. This indicates that the library in which this file is loaded contains package fabric cellviews. Note that it is important for libraries containing package cellviews to contain this construct. Many Virtuoso RF Solution features depend on this designation in the technology database.

layerDefinitions section

techLayers sub-section

There are two changes in this section. For every layer in the layer cross section, a VOID layer is added to allow the voiding of shapes on that layer. For details, refer to. Conceptually, it can be viewed as a Boolean operation that creates a hole in the layer it voids. This allows shapes on other nets to be created in the hole without creating an electrical short with the net on the layer that is being voided. See

The new built-in layers that are added for the Virtuoso RF Solution are highlighted in this section. These layers are used to build Technology Independent Layout Pcells (TILP) that are one of the  foundations of the Virtuoso RF Solution. Technology independence allows components to be created without being aware of the target technology. When a technology independent Pcell is instantiated in a package layout (parentCell), the library containing the parent cell (parentCellLibName) is used to find the technology database associated with this instantiation. Shapes on generic layers (using the System-reserved layers highlighted in this section) are mapped to the appropriate layer in the package substrate described in the technology database. For example, shapes on the beginGeneric layer are mapped to either the top or the bottom of the package substrate depending on whether the component is connected to the top of the substrate or the bottom of the substrate.

techLayerPurposePriorities sub-section

New layer purposes are provided for each layer and purpose combination within the layer cross section. A new built-in purpose dynamic allows the voiding of planes. In the below-mentioned techDerivedLayers section, a boolean operation is specified to select shapes on the dynamic purpose and remove (NOT operation) the corresponding VOID shapes to create the effective conducting plane for that net.

techDerivedLayers sub-section

In this section, the boolean operations governing the behavior of voiding are provided. For example, in the operation below, M1_PLANE selects all the shapes on M1/dynamic and, M1_SHAPE subtracts the shapes on M1_VOID from M1_PLANE to generate the effective conducting shape.

( M1_PLANE                  549        ( M1         'select  dynamic   ))

  ( M1_SHAPE                  550        ( M1_PLANE   'not    M1_VOID   ))

layerRules section

functions sub-section

The voiding layer purpose pairs are explicitly identified as containing a function of trims() indicating that they perform a negative operation on some other layer purpose pair. Dielectric layers are also designated a function of "dielectric" indicating that they are not conducting layers.

analysisAttributes sub-section

The analysisAttribute section is used to describe each layer of the cross-section in sufficient detail to allow accurate 3D extraction. The new attributes that are available are:

• materialName
• thickness
• conductivity
• permittivity
• lossTangent

For details, refer to Navigating through a Technology File.

constraintGroups section

constraintGroups section

The constraintGroups section has been enhanced to describe packaging constraints. Width, spacing, and hole spacing constraints can be defined for each layer. New parameters are provided on these constraints that allow the specification of spacing values. Spacing check is performed on these values based on the object types. For example, different spacing values can be provided between a

• M1 shape in a via and a M1 shape represented as a line (path).
• M1 shape in a bond finger cell and M1 shape represented as a shape (polygon).

The complete list of these types are: line, pin, thruPin, smdPin, testPin, thruVia, bbVia, testVia, microVia, shape, bondFinger, and via.