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Package Schematic Creation

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The package schematic contains the symbols of SMDs from SiP and the die symbol obtained from die export. It can contain more components, such as LGA, embedded components, and Transmission Lines (TLines). The package schematic contains the IC and package portions of the design that are represented, designed, and verified within a single environment. It eliminates the tedious and error prone process of maintaining multiple schematic databases. It lets you Edit-in-Concert the package and IC in the design flow. For example, you can explore the possibility of implementing a selected passive component of the IC, verify the performance by running a simulation, and decide about how best to implement the component. In some cases, a network of passive components may be better implemented across the boundary of the die placed on a package. This is true for RF modules, where the optimum design of filtering and matching networks often leverages components on both the die and in the package substrate.