mult=1

Number of devices in parallel.

printscaled=0

Print scaled parameter info if value not equal to zero.

trise=0 K

Difference between the local ambient and global ambient temperature.

region=triode

Estimated DC operating region, used as a convergence aid. Possible values are off, triode, sat, and subth.

m=1

Alias of mult.

mos_region=SUBTHRESHOLD

diode_region=ON

level=1.1e+03

Transistor Level.

paramchk=0

Level of clip warning info.

vbox=0 V

Oxide breakdown voltage.

vbds=0 V

Drain-source breakdown voltage.

tmin=0 s

Ovcheck tmin value.

tr=21 C

Reference temperature.

vfb=-1.05 V

Flat-band voltage at reference temperature.

stvfb=0.0005 V/K

Coefficient of temperature dependence of VFB.

ko=0.5 V

Body-effect factor.

kpinv=0 1/V

Inverse of body-effect factor of the poly-silicon gate.

phib=0.95 V

Surface potential at the onset of strong inversion.

stphib=-0.00085 V/K

Coefficient of the temperature dependency of PHIB.

bet=0.00192(n)/0.000381(p) A/V²

Gain factor.

etabet=1.3(n)/0.5(p)

Exponent of the temperature dependence of the gain factor.

thesr=0.356(n)/0.73(p) 1/V

Mobility degradation parameter due to surface roughness scattering.

etasr=0.65(n)/0.5(p)

Exponent of the temperature dependence of THESR.

theph=0.0129(n)/0.001(p) 1/V

Mobility degradation parameter due to phonon scattering.

etaph=1.35(n)/3.75(p)

Exponent of the temperature dependence of THEPH.

etamob=1.4(n)/3(p)

Effective field parameter for dependence on depletion charge.

stetamob=0 1/K

Coefficient of the temperature dependence of ETAMOB.

nu=2

Exponent of field dependence of mobility model.

nuexp=5.25(n)/3.23(p)

Exponent of the temperature dependence of parameter NU.

ther=0.0812(n)/0.079(p) 1/V

Coefficient of series resistance.

etar=0.95(n)/0.4(p)

Exponent of the temperature dependence of THER.

ther1=0 V

Numerator of gate voltage dependent part of series resistance.

ther2=1 V

Denominator of gate voltage dependent part of series resistance.

thesat=0.251(n)/0.173(p) 1/V

Velocity saturation parameter due to optical/acoustic phonon scattering.

etasat=1.04(n)/0.86(p)

Exponent of the temperature dependence of THESAT.

theth=1e-05(n)/0(p) 1/V³

Coefficient of self-heating.

sdibl=0.000853(n)/3.55e-05(p) 1/V

Drain-induced barrier lowering parameter.

mo=0

Parameter for (short-channel) subthreshold slope.

ssf=0.012(n)/0.01(p) 1/V

Static-feedback parameter.

alp=0.025

Factor of channel length modulation.

vp=0.05 V

Characteristic voltage of channel-length modulation.

mexp=5

Smoothing factor.

a1=6.02(n)/6.86(p)

Factor of the weak-avalanche current.

sta1=0 1/K

Coefficient of the temperature dependence of A1.

a2=38(n)/57.3(p) V

Exponent of the weak-avalanche current.

a3=0.641(n)/0.425(p)

Factor of the drain-source voltage above which weak-avalanche occurs.

iginv=0 A/V²

Gain factor for intrinsic gate tunneling current in inversion.

binv=48(n)/87.5(p) V

Probability factor for intrinsic gate tunneling current in inversion.

igacc=0 A/V²

Gain factor for intrinsic gate tunneling current in accumulation.

bacc=48 V

Probability factor for intrinsic gate tunneling current in accumulation.

vfbov=0 V

Flat-band voltage for the Source/Drain overlap extensions.

kov=2.5 V

Body-effect factor for the Source/Drain overlap extensions.

igov=0 A/V²

Gain factor for Source/Drain overlap tunneling current.

agidl=0 A/V³

Gain factor for gate-induced leakage current.

bgidl=41 V

Probability factor for gate-induced drain leakage current at reference temperature.

stbgidl=-0.000364 V/K

Coefficient of the temperature dependence of BGIDL.

cgidl=0

Factor for the lateral field dependence of the gate-induced leakage current.

cox=2.98e-14(n)/2.72e-14(p) F

Oxide capacitance for the intrinsic channel (* mult).

cgdo=6.39e-15(n)/6.36e-15(p) F

Oxide capacitance for the gate-drain overlap (* mult).

cgso=6.39e-15(n)/6.36e-15(p) F

Oxide capacitance for the gate-source overlap (* mult).

gatenoise=0

Flag for in/exclusion of induced gate thermal noise.

nt=1.62e-20 J

Thermal noise coefficient.

nfa=8.32e+22(n)/1.9e+22(p) 1/(Vm⁴)

First coefficient of the flicker noise.

nfb=2.51e+07(n)/5.04e+06(p) 1/(Vm²)

Second coefficient of the flicker noise.

nfc=0(n)/3.63e-10(p) 1/V

Third coefficient of the flicker noise.

tox=3.2e-09 m

Thickness of gate oxide layer.

dta=0 K

Temperature offset of the device.

cs=0

Coefficient of Coulomb scattering.

etacs=0

Exponent of the temperature dependence of CS.

rg=0 Ω

Gate resistance.

rth=300 K/W

Thermal resistance.

cth=3e-09 J/K

Thermal capacitance.

ath=0

Temperature coefficient of the thermal resistance.

scalelev=1.1e+04

Flag for eldo model.

type=n

Transistor gender. Possible values are n and p.

imax=1000 A

Explosion current.

mbe=0.0

DCmatch parameter.

mvt=0.0

Threshold mismatch intercept.

tnom (C)

Alias of tnom.

tref (C)

Alias of tnom.

compatible=spectre

Encourage device equations to be compatible with a foreign simulator. Possible values are spectre, spice2, spice3, cdsspice, spiceplus, eldo, sspice, mica, and pspice.

tempeff (C)

Effective temperature for a single device.

meff

Effective multiplicity factor (m-factor).

ids (A)

Drain current, excluding avalanche and tunnel currents.

iavl (A)

Substrate current due to weak-avalanche.

igs (A)

Gate-to-source current due to direct tunneling.

igd (A)

Gate-to-drain current due to direct tunneling.

igb (A)

Gate-to-bulk current due to direct tunneling.

vds (V)

Drain-source voltage.

vgs (V)

Gate-source voltage.

vsb (V)

Source-bulk voltage.

vto (V)

Zero-bias threshold voltage.

vts (V)

Threshold voltage including back-bias effects.

vth (V)

Threshold voltage including back-bias and drain-bias effects.

vgt (V)

Effective gate drive voltage including back-bias and drain voltage effects.

vdss (V)

Drain saturation voltage at actual bias.

vsat (V)

Saturation limit.

gm (A/V)

Transconductance (d ids / d vgs).

gmb (A/V)

Substrate-transconductance (d ids / d vbs).

gds (A/V)

Output conductance (d ids / d vds).

cdd (F)

Capacitance (d qd / d vd).

cdg (F)

Capacitance (- d qd / d vg).

cds (F)

Capacitance (- d qd / d vs).

cdb (F)

Capacitance (- d qd / d vb).

cgd (F)

Capacitance (- d qg / d vd).

cgg (F)

Capacitance (d qg / d vg).

cgs (F)

Capacitance (- d qg / d vs).

cgb (F)

Capacitance (- d qg / d vb).

csd (F)

Capacitance (- d qs / d vd).

csg (F)

Capacitance (- d qs / d vg).

css (F)

Capacitance (d qs / d vs).

csb (F)

Capacitance (- d qs / d vb).

cbd (F)

Capacitance (- d qb / d vd).

cbg (F)

Capacitance (- d qb / d vg).

cbs (F)

Capacitance (- d qb / d vs).

cbb (F)

Capacitance (d qb / d vb).

cgdol (F)

Gate-drain overlap capacitance of the actual transistor.

cgsol (F)

Gate-source overlap capacitance of the actual transistor.

rg (Ω)

Gate resistance.

u

Transistor gain (gm/gds).

rout (Ω)

Small-signal output resistance (1/gds).

vearly (V)

Equivalent Early voltage (|id|/gds).

keff (V )

Body effect parameter.

beff (A/V²)

Gain factor.

fug (Hz)

Unity gain frequency at actual bias (gm/(2*pi*cin)).

sqrtsfw (V/Hz )

Input-referred RMS white noise voltage density.

sqrtsff (V/Hz )

Input-referred RMS white noise voltage density at 1 kHz.

fknee (Hz)

Cross-over frequency above which white noise is dominant.

Pdiss (W)

Dissipation.

TK (K)

Actual device temperature.

table_ids (A)

Current.

table_vth (V)

Threshold voltage including back-bias and drain-bias effects.

table_qg (Coul)

Charge at g node.

table_qd (Coul)

Charge at d node.

table_qb (Coul)

Charge at b node.

ctype

Channel type (-1 for PMOS, +1 for NMOS).

von (V)

Signed vth (<0 for PMOS, >0 for NMOS).

pwr (W)

Power.

mos_region

MOS region.
Possible values are off, sat, triode, and subth

diode_region

DIODE region.
Possible values are off and on.