Bump Array Specifications

Lets you specify the following bump array settings.

X-Origin

Specifies the X coordinate of the first bump of the array.

Y-Origin

Specifies the Y coordinate of the first bump of the array.

Horizontal Pitch

Specifies the horizontal distance between the bump edges.

Vertical Pitch

Specifies the vertical distance between the bump edges.

No. of Rows

Specifies the number of rows to be generated in the bump array.

No. of Columns

Specifies the number of columns to be generated in the bump array.

Bump

Specifies the Library, Cell, and View of the cellview that defines the bumps.

Create TSV

Specifies the following TSV settings.

Via Definition

Lists all the standard and custom vias that are available in the technology file.

X-Offset

Specifies the X offset of the TSV.

Y-Offset

Specifies the Y offset of the TSV.