Create

Specifies what must be created - Bond Wire, Bond Finger, or Both.

Environment variable: createWireFingerOrBoth

Wire Profile

Lists all wire profiles that are defined in the technology file. This option lists all the wire profiles that are defined in the technology file. A wire profile defines bond wire properties such as the width of the wire. These properties are not listed in Property Editor and therefore cannot be edited after the bond wires are created.

Environment variable: bumpCenterMismatchCheck

Snap To

Specifies whether the components must snap to Bond Finger, Guide, or Die IO.

Distribute On Guide

Specifies how bond fingers are to be distributed on the guide.

• Uniform: Distributes bond fingers evenly along the guide.
• Orthogonal: Places bond fingers orthogonal to the guide. The bond fingers are placed at the nearest point in the guide, and therefore this setting ensures the shortest bond wire length.
• Any Angle: Uses the pkgMinBondwireSpacing constraint value to determine the minimum spacing between adjacent bond fingers.

Definition

Specifies a bond finger definition. To create a new definition, click Add. To view an existing definition, select it from the drop-down list and click Display.

Environment variable: bondFingerProfile

Alignment

Specifies the bond finger alignment - along wire or orthogonal to die.

Environment variable: bondFingerAlignment

Honor Constraints

Specifies whether the constraints or the bond wire profile get higher priority while defining the settings.