Product Documentation
Virtuoso MultiTech Framework User Guide
Product Version IC23.1, November 2023

Import Bump Info Form

The following table describes the fields available in the Import Bump Info form.

Field Description

Bump File Path

Specifies the path to the file that contains bump information.

Create TSV

Specifies the following TSV settings.

Via Definition

Lists all the standard and custom vias that are available in the technology file.

X-Offset

Specifies the X offset of the TSV.

Y-Offset

Specifies the Y offset of the TSV.

Related Topics

Creating Bumps from File


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