Export Die Form
Use the Export Die form to specify inputs required for die generation. The form contains the following tabs.
|
Tab
|
Description
|
|
General Settings
|
Lets you specify the most important options and know where the data is being exported.
|
|
Advanced Settings
|
Lets you specify the settings regarding how the views will be generated, s-parameter model to be added to an abstract view, or whether the Pin Numbering and Area Transfer tabs should be enabled.
|
|
Pin Numbering
|
Lets you specify the settings for defining pin names of the footprint that are called pin numbers. They can be set by using them as is in an abstract view, using the numbers from a die text file, or using predefined algorithms.
|
|
Area Transfer
|
Lets you specify some additional shapes other than bumps to be exported in an abstract view.
|
General Settings
The following table describes the fields available on the General Settings tab of the Export Die form.
|
Field
|
Description
|
|
Die Interface Type
|
Specifies one of the following type of interface for which a die is being exported to identify bumps or pads.
-
IO cells if the bumps or pads are defined as cells having their cellType set to
coverBump or pad. This is the recommended method because it enables editing-in-concert and the Layout Versus Abstract check. -
Shapes with overlapping labels if the bumps can only be retrieved from the association of a shape and a label. This method does not enable editing-in-concert and the Layout Versus Abstract check.
|
|
Front Pin Layer
|
Specifies the layer purpose pair of the bump or pad on the front side of a die. It is usually the highest metal layer of a die.
|
|
Front Label Layer
|
Specifies the layer purpose pair of the bump or pad on the back side of a die when bumps and pads have been placed on both the sides of a die.
|
|
Back Pin Layer
|
Specifies the type of layer that should be read to obtain back side pin information.
|
|
Back Label Layer
|
Specifies the type of layer that should be read to know the back label.
|
|
Library
|
Specifies the name of the library to be generated after the export die step is successfully completed.
|
|
Cell
|
Specifies the name of the cell to be generated after the export die step is successfully completed.
|
Advanced Settings
The following table describes the fields available on the Advanced Settings tab of the Export Die form.
|
Field
|
Description
|
|
Include unconnected IO Pad cells
|
When selected, includes unconnected IO pads while exporting the die.
|
|
Customize pin numbers
|
When selected, enables the Pin Numbering tab.
|
|
Transfer area
|
When selected, enables the Area Transfer tab.
|
|
Output Mode
|
Specifies how views will be updated while exporting a die. Generate all views value ensures that all views are created during die export. Update existing symbol and generate others allows to only update the symbol view and create the remaining views. Generate all views (schematic view when possible) lets you generate all possible views during die export, however, generating a schematic view is optional.
|
|
Delete existing views before export
|
When selected, all the die export views of the specified cell in the specified library are deleted before exporting.
If the library pre-exists, the other views and cells are not deleted. However, if the library is created during die export, it gets deleted if export fails.
When the value of Output Mode is set as Update existing symbol and generate others, the Delete existing views before export check box is deselected and disabled.
When the value of Output Mode is set as Generate all views (schematic view when possible), the Delete existing views before export check box is selected and disabled.
|
|
Attach model during die export
|
Enables the fields to attach models during die export.
|
|
Model View Name
|
Displays the view name of the model.
|
|
Model File
|
Specifies the name and the location of the model file being imported.
|
|
CSV File
|
Specifies the name of a part.csv file to add extra information in the file.
|
Pin Numbering
The following table describes the fields available on the Pin Numbering tab of the Export Die form.
|
Field
|
Description
|
|
Mode
|
Specifies the options for defining pin numbers, that is, footprint pin names.
-
Use pin names as numbers uses the same pin names for the symbol and footprint views in the generated abstract and ensures that the names are unique.
-
Use numbers as-is is chosen when IO cells properties is read to assign pin numbers.
-
Use numbers from file is chosen when the pin numbers are defined in a die text file. It is specified in the Die Text File field.
-
Use predefined ordering is chosen when pin ordering algorithms are used. The Ordering drop-down list is enabled to select predefined or custom algorithm.
|
|
Die Text File
|
Specifies the die text file to be referenced when generating die pin numbers.
Environment variable: pinNumberFile
|
|
Ordering
|
Specifies the options to define pin numbering based on algorithms.
-
Vertical – bottom right value ensures that the pin at the bottom-right corner is considered as the first pin. The other pins are placed column-wise from bottom to top.
-
Vertical – bottom right minimum distance indicates that the pin located at the minimum diagonal distance from the bottom right of the die is considered as the first pin. The other pins are placed column-wise from bottom to top.
-
When Custom is selected, you can define a custom algorithm by using SKILL.
Environment variables: pinOrdering, pinOrderingCustom
|
Area Transfer
The following table describes the fields available on the Area Transfer tab of the Export Die form.
|
Field
|
Description
|
|
Area Transfer File
|
Specifies an XML file that includes rules to add some additional shapes in an abstract view, such as logos. Cadence recommends that you use a non-conductor SIP_SHAPE_CLASS layer (such as COMPONENT GEOMETRY) as the target layer in the XML file instead of a conductor layer. SiP Layout Option does not support CONDUCTOR class shapes or clines in die symbols because their corresponding layer might change unpredictably when the die orientation or placement is modified in the stack.
|
Related Topics
Exporting Dies
Virtuoso Multi-Technology Forms
Return to top