Product Documentation
Virtuoso MultiTech Framework User Guide
Product Version IC23.1, November 2023

Virtuoso RF Compliance Audit Form

Lets you perform preliminary checks through the use of a template file to avoid rework in the Virtuoso RF Solution processes.

Field Description

Die Export

This section specifies the checks to audit the die export functionality.

Template File

Specifies the template file that is exported from the Export Die form to provide the desired settings for die audit.

Environment variable: dieTemplateFile

Library Check

Checks whether coverBump or pad cells exist in the library.

Environment variable: libraryCheck

Terms Check

Checks for dangling and floating terminals, terminals with incorrect direction, and terminals not connected to a coverBump or pad cell.

Environment variable: termsCheck

IC Symbol Check

Checks for missing IC symbols. Also, performs compatibility checks on symbols.

Environment variable: icSymbolCheck

IO Check

Checks that pad shapes exist on the specified layers and that the layer-purpose pairs are correctly defined in the technology file. Also reports duplicate pin numbers of IOs, overlapping pads, multiple connections exist to top-level terminals for an IO, or instance terminal mismatch.

Environment variable: ioCheck

Other Checks

Performs PR boundary checks.

Environment variable: otherChecks

Related Topics

Die Audit

vrfComplianceAudit


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