Stacked Module Assemblies

Virtuoso Stacked Silicon solution supports the following types of stacked module assemblies:

Package -> ICs
In this type of assembly, individual dies are stacked on a package. Dies can be stacked horizontally or vertically.
Generic Container -> Stacked ICs
In the absence of a package, a generic container is used to instantiate a Technology Independent Layout Pcells (TILP). Dies are stacked vertically on a generic container.
Generic Container or Package -> Interposer -> Stacked ICs
In such an assembly, dies are stacked on an interposer. The interposer is stacked on a package or generic container. The interposer acts as a routing channel to establish die-to-die and die-to-package connections using TSV.
Board -> Package -> IC
In such an assembly, a package is mounted vertically on a PCB. The assembly could have a combination of dies, stacked dies, packages, or stacked packages mounted on the board.