Benefits of Implementing Stacked Modules

Heterogeneous Dies
An IC package can accommodate multiple heterogeneous dies, such as logic, memory, analog, RF, and micro-electrical mechanical systems (MEMS) at different process nodes, such as 28nm for high-speed logic and 130nm for analog. Multiple dies that are manufactured separately using different process technologies can be stacked and bonded into a single package.
Isolated Digital and Analog Substrates
Using the Virtuoso Stacked Silicon solution ensures the isolation of digital substrates from analog substrates, thus avoiding any digital-to-analog or analog-to-digital substrate noise propagation.
Reduced Form Factor
Stacking dies allows miniaturization, thus saving space on the board and in the end product. This solution is ideal for extremely compact mobile devices.
Low Power Consumption
Using stacked devices can reduce power because big drivers are no longer needed. A stack can use small I/O drivers with lower power. Reduced RLC (which stands for resistance-inductance-capacitance) helps reduce power. The interconnect between packages is also reduced, leading to better performance and power profiles.