5
Package Layout Creation
Package layout is generated from the package schematic for editing the package layout. To complete the physical layout, use GFS to generate the layout. If there are flip chip attachments, use the appropriate instance properties to place the components on the top or bottom of the substrate with the correct orientation. Connect balls to IO pads through curved paths by using flight lines and connectivity/DRC markers in the Annotation Browser. You need to fix shorts on signals with power and ground planes by creating dynamic shapes and performing voiding. The synchronized edits in the die abstract and layout are covered in the Edit-in-Concert topic.
Module fabrics are treated the same way as package fabrics. Therefore, the commands in the Module menu are available to cellviews with package and module fabrics.
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