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Edit-in-Concert

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The Edit-in-Concert feature lets you view and edit die packages and their corresponding die layouts synchronously. It enables the IC designers and package designers, who are cross-geographically located and work on different platforms, update the designs (die or package) using the abstract files that do not require synchronous or concurrent operation of the tools. For example, when a layout engineer creates a die layout and a package engineer creates the corresponding die package.

• In die layouts, device placement is driven by factors such as the internal blocks of the design, routing of the layout, and the power requirements of the layout.
• In die packages, device placement is determined by factors such as the final alignment with the package BGA, the minimum bond wire lengths, and the usage of passive elements in the package.

You can use Edit-in-Concert to view and edit the board, package, and layout synchronously. Edit-in-Concert lets you:

• Visualize the IC in the context of the package and see where a change to one die impacts the design of the other.
• Ensure that the combination of die layout and the die package meets all design requirements, while minimizing the overall cost of production.

In Edit-in-Concert mode, the dies in a package are superimposed. The current die is displayed in the foreground, available for edit. The dies in the background serve as a template to guide the design.