Types of Libraries for Creating Unified Libraries

You can use unified libraries to enable all the Virtuoso multiple technology flows. Design data libraries from various sources are imported or created as unified libraries in the following ways:

• Allegro views and self-contained SiP files are imported by the libImport utility to create abstracts for padstacks, LGA/BGA packages, discrete devices, and dies.
• Virtuoso IC abstracts are created by Die Export.
• Vendor libraries of discrete devices are imported through CSV Import.

The following types of design data libraries can be made as unified libraries:

• Exported Die Library
• BGA Library
• Tline Library
• pkgLib Library
• Passive Component Library
• CSV Import Library

Exported Die Library

Exporting a die from a Virtuoso layout generates the following data:

• Abstract: This contains the instances of the padstack that correspond to the IO cell or shape-based interfaces in the source IC layout. The terminal names in the abstract view correspond to the physical domain names.
• Symbol: This corresponds to the logical interface of the physical footprint of the exported die. The terminal names in the symbol view correspond to the logical domain names.
• Schematic: This is the mapping schematic between the source IC symbol view and the exported symbol view. The duplicate pins in the source IC layout are made unique. Therefore, this mapping schematic has connectivity from the unique interface of the exported die to the generic interface of the source IC.
• Layout: This is the placeholder die TILP cellview.

Exporting the die also creates one cell for each unique padstack used in the die abstract. Consequently, the following views are created for the padstack:

• Abstract: base cellview of the padstack
• Layout: placeholder padStack TILP cellview

Preparing for Die Export

To ensure that the die abstract is accurate before using it in the package, you need to prepare the die. There are three important requirements. For details, refer to Preparing for Die Export.

Exporting Dies

This is the step in the flow where the IC/die footprint is handed over to the package designer. By exporting the die, you can create technology-independent abstraction, which enables Edit-in-Concert, layout versus abstract (LVA) checks, and cross-fabric simulation using die schematic and model-based simulation for dies. For details, refer to Exporting Dies.

BGA Library

Ball grid array (BGA) is a type of die component whose pins are solder balls arranged in a grid pattern. For an effective use model, group multiple BGAs within a part table.

Tline Library

The Tline library contains the symbol view, simulation view, and OpenAccess layout view for TLines. You can instantiate the symbol views and capture connectivity in the package schematic. Tline components are derived from rfTlineLib, which is a library of wideband-accurate transmission line models in multi-conductor microstrip and stripline configurations.

pkgLib Library

The pkgLib library contains wirebonds and fingers. These are stored as TILPs in the library for use in the Virtuoso Multi-Technology Solution. The mapping from Virtuoso instance parameters to Allegro symbol parameters is provided in the TILP parameter mapping.

Passive Component Library

The passive library contains different topologies of inductors to be implemented as generic TILPs in Virtuoso.

CSV Import Library

The CSV library describes the part variants as CDF parameters in Virtuoso. There is a need to support .csv import functionality for vendor-provided SMD libraries. The component definitions are created with the name-to-number mapping for pins. Subsequently, you can create the base cellview and the TILP that can be instantiated in the layout views.

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