Die Export
You can instantiate die footprints of ICs in the package layout from package library. IC/die footprint is the cellview in Virtuoso representing an IC design that includes the layout, schematic, and symbol. Exported die is the cellview that represents the footprint of the Die/IC/package, which will be instantiated in the package design. It contains an abstract, TILP, schematic, and symbol view. IO cell is also instantiated in the die/IC layout to represent its external connectivity.
During die export, the IC/die footprint is handed over to the package designer. By exporting the die, you can create technology-independent abstraction, which enables Edit-in-Concert, layout versus abstract (LVA) checks, and cross-fabric simulation using die schematic and model-based simulation for dies.
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