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level=1.1e+04
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Transistor Level.
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paramchk=0
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Level of clip warning info.
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vbox=0 V
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Oxide breakdown voltage.
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vbds=0 V
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Drain-source breakdown voltage.
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tmin=0 s
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Ovcheck tmin value.
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lvar=0 m
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Difference between the actual and the programmed poly-silicon gate length.
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lap=4e-08 m
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Effective channel length reduction per side.
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wvar=0 m
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Difference between the actual and the programmed field-oxide opening.
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wot=0 m
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Effective channel width reduction per side.
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tr=21 C
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Reference temperature.
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vfb=-1.05 V
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Flat-band voltage at reference temperature.
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stvfb=0.0005 V/K
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Coefficient of temperature dependence of VFB.
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kor=0.5 V
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Body effect coefficient for the reference transistor.
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slko=0
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Coefficient of the length dependence of KO.
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sl2ko=0
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Second coefficient of the length dependence of KO.
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sl3ko=0
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Third coefficient of the length dependence of KO.
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sl3koexp=1
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Exponent belonging to the third coefficient of the length dependence of KO.
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swko=0
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Coefficient of the width dependence of KO.
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kpinv=0 1/V
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Inverse of body-effect factor of the poly-silicon gate.
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phibr=0.95 V
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Surface potential at strong inversion.
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stphib=-0.00085 V/K
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Coefficient of the temperature dependency of PHIB.
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slphib=0
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Coefficient of the length dependence of PHIB.
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sl2phib=0
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Second coefficient of the length dependence of PHIB.
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swphib=0
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Coefficient of the width dependence of PHIB.
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betsq=0.000371(n)/0.000115(p) A/V2
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Gain factor for an infinite square transistor.
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etabetr=1.3(n)/0.5(p)
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Exponent of the temperature dependence of the gain factor.
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sletabet=0
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Coefficient of length dependence of ETABETR.
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fbet1=0
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Relative mobility decrease due to first lateral profile.
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lp1=8e-07 m
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Characteristic length of first lateral profile.
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fbet2=0
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Relative mobility decrease due to second lateral profile.
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lp2=8e-07 m
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Characteristic length of second lateral profile.
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thesrr=0.4(n)/0.73(p) 1/V
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Coefficient of the mobility reduction due to surface roughness scattering.
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etasr=0.65(n)/0.5(p)
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Exponent of the temperature dependence of THESR.
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swthesr=0
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Coefficient of the width dependence of THESR.
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thephr=0.0129(n)/0.001(p) 1/V
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Coefficient of the mobility reduction due to phonon scattering.
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etaph=1.35(n)/3.75(p)
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Exponent of the temperature dependence of THEPH.
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swtheph=0
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Coefficient of the width dependence of THEPH.
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etamobr=1.4(n)/3(p)
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Effective field parameter for dependence on depletion/inversion charge.
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stetamob=0 1/K
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Coefficient of the temperature dependence of ETAMOB.
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swetamob=0
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Coefficient of the width dependence of ETAMOB.
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nu=2
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Exponent of field dependence of mobility model.
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nuexp=5.25(n)/3.23(p)
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Exponent of the temperature dependence of parameter NU.
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therr=0.155(n)/0.08(p) 1/V
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Coefficient of the series resistance.
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etar=0.95(n)/0.4(p)
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Exponent of the temperature dependence of THER.
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swther=0
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Coefficient of the width dependence of THER.
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ther1=0 V
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Numerator of gate voltage dependent part of series resistance.
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ther2=1 V
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Denominator of gate voltage dependent part of series resistance.
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thesatr=0.5(n)/0.2(p) 1/V
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Velocity saturation parameter due to optical/acoustic phonon scattering.
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etasat=1.04(n)/0.86(p)
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Exponent of the temperature dependence of THESAT.
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slthesat=1
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Coefficient of length dependence of THESAT.
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thesatexp=1
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Exponent of length dependence of THESAT.
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swthesat=0
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Coefficient of the width dependence of THESAT.
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thethr=0.001(n)/0.0005(p) 1/V3
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Coefficient of self-heating.
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thethexp=1
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Exponent of the length dependence of THETH.
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swtheth=0
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Coefficient of the width dependence of THETH.
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sdiblo=0.0001 1/V
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Drain-induced barrier lowering parameter.
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sdiblexp=1.35
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Exponent of the length dependence of SDIBL.
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moo=0
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Parameter for short-channel subthreshold slope.
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mor=0
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Parameter for short-channel subthreshold slope per unit length.
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moexp=1.34
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Exponent of the length dependence of MO.
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ssfr=0.00625 1/V
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Static feedback parameter.
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slssf=1
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Coefficient of the length dependence of SSF.
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swssf=0
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Coefficient of the width dependence of SSF.
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alpr=0.01
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Factor of the channel length modulation.
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slalp=1
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Coefficient of the length dependence of ALP.
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alpexp=1
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Exponent of the length dependence of ALP.
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swalp=0
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Coefficient of the width dependence of ALP.
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vp=0.05 V
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Characteristic voltage of channel-length modulation.
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lmin=1.5e-07 m
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Minimum effective channel length in technology, used for calculation of smoothing factor m.
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a1r=6
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Factor of the weak-avalanche current.
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sta1=0 1/K
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Coefficient of the temperature dependence of A1.
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sla1=0
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Coefficient of the length dependence of A1.
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swa1=0
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Coefficient of the width dependence of A1.
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a2r=38 V
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Exponent of the weak-avalanche current.
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sla2=0
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Coefficient of the length dependence of A2.
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swa2=0
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Coefficient of the width dependence of A2.
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a3r=1
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Factor of the drain-source voltage above which weak-avalanche occurs.
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sla3=0
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Coefficient of the length dependence of A3.
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swa3=0
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Coefficient of the width dependence of A3.
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iginvr=0 A/V2
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Gain factor for intrinsic gate tunneling current in inversion.
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binv=48(n)/87.5(p) V
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Probability factor for intrinsic gate tunneling current in inversion.
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igaccr=0 A/V2
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Gain factor for intrinsic gate tunneling current in accumulation.
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bacc=48 V
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Probability factor for intrinsic gate tunneling current in accumulation.
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vfbov=0 V
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Flat-band voltage for the Source/Drain overlap extensions.
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kov=2.5 V
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Body-effect factor for the Source/Drain overlap extensions.
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igovr=0 A/V2
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Gain factor for Source/Drain overlap gate tunneling current.
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agidlr=0 A/V3
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Gain factor for gate-induced leakage current.
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bgidl=41 V
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Probability factor for gate-induced drain leakage current at reference temperature.
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stbgidl=-0.000364 V/K
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Coefficient of the temperature dependence of BGIDL.
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cgidl=0
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Factor for the lateral field dependence of the gate-induced leakage current.
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tox=3.2e-09 m
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Thickness of gate oxide layer.
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col=3.2e-16 F
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Gate overlap capacitance for a channel width of 1 um.
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gatenoise=0
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Flag for in/exclusion of induced gate thermal noise.
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nt=1.62e-20 J
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Thermal noise coefficient.
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nfar=1.57e+23(n)/3.83e+24(p) 1/(Vm4)
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First coefficient of the flicker noise for a channel area of 1 um^2.
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nfbr=4.75e+09(n)/1.02e+09(p) 1/(Vm2)
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Second coefficient of the flicker noise for a channel area of 1 um^2.
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nfcr=0(n)/7.3e-08(p) 1/V
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Third coefficient of the flicker noise for a channel area of 1 um^2.
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dta=0 K
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Temperature offset of the device.
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rgo=0 Ω
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Gate resistance.
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rint=0 Ω m2
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Contact resistance between silicide and poly.
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rvpoly=0 Ω m2
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Vertical poly resistance.
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rshg=0 Ω/Sqr
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Gate electrode diffusion sheet resistance.
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dlsil=0 m
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Silicide extension over the physical gate length.
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rth=300 K/W
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Thermal resistance.
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cth=3e-09 J/K
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Thermal capacitance.
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ath=0
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Temperature coefficient of the thermal resistance.
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binning=0
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flag for eldo model.
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type=n
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Transistor gender. Possible values are n and p.
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imax=1000 A
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Explosion current.
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tnom (C)
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alias of tnom.
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tref (C)
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alias of tnom.
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compatible=spectre
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Encourage device equations to be compatible with a foreign simulator. Possible values are spectre, spice2, spice3, cdsspice, spiceplus, eldo, sspice, mica, and pspice.
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