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3D Electromagnetic Simulation

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Clarity and EMX are integrated as the extraction engines into the Electromagnetic Solver in Layout MXL. They let you create models by using Sigrity 2019 from the layout. Solvers can simulate a metal structure in full 3D and find its RF behavior for many different frequencies. The result is a matrix of S-Parameters that is read by Spectre to achieve accurate simulations.

In general, models consist of nets and instances. IC models contain a process stack read from the ICT file.

On the other hand, package models contain a process stack read from techDB. Vias in package are exported as padstacks to the solver. The flip chip bumps and BGA balls are automatically created during EM simulation.