Thermal Analysis
Once you have placed components and defined constraints and stackup, you can perform thermal analysis. In this phase, you use thermal analysis to predict the junction and case temperatures within the component being designed. Through thermal analysis, you can quickly identify component temperatures that violate constraint criteria.
You can rectify thermal violations by applying one or more of the following corrective measures:
- Modify die placement, if multiples are being used
- Add plane layers to the stackup
- Use alternative substrate materials
- Add thermal vias
- Add heat sinks
- Experiment with alternative boundary conditions (estimate performance under various environmental conditions)
You can apply these measures in multiple “what-if” scenarios to arrive at an optimal solution.
Related Topics
Die-to-Component I/O Net Assignment
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