BSIM4 Version 6.1
C-V Model
A new VgsteffCV definition is introduced in the C-V model to improve threshold fitting. Six new parameters have been added: CVCHARGEMOD, MINVCV, LMINVCV, WMINVCV, WMINVCV, PMINVCV, and VOFFCVL.
New Material Model
A new materials model (activated by setting MTRLMOD=1) has been introduced with the following features:
New Materials Model Parameters
Model selector:
MTRLMOD : =1 activates the new-materials option and =0 (default) deactivates
For non-poly-silicon gate:
- PHIG : Gate work function
- EPSRGATE : Dielectric constant of gate relative to vacuum ( = 0 deactivates poly depletion)
For non-SiO2 gate-dielectric:
For non-silicon channel material:
- EASUB : Electron affinity of substrate
- EPSRSUB : Dielectric constant of substrate relative to vacuum
- NI0SUB : Intrinsic carrier concentration at T=300.15K
- BG0SUB : Band-gap of substrate at T=0K
- TBGASUB : First parameter of band-gap change due to temperature
- TBGBSUB : Second parameter of band-gap change due to temperature
- ADOS : Density of states parameter to control charge centroid
- BDOS : Density of states parameter to control charge centroid
Non-Silicon Channel Material
Defines the temperature-dependent intrinsic carrier concentrations and the band gap with the new non-silicon parameters for MTRLMOD = 1.
Introduces two new parameters for charge centroid for non-silicon channel materials in both I-V and C-V models.
Non-SiO2 Dielectric Material
For MTRLMOD = 1, use EOT (defined as the electrical oxide thickness at Vgs = VDDEOT) to calculate oxide thickness at flatband voltage.
Non-poly-Si gate Material
Poly depletion is calculated using the following equation:
Setting EPSRGATE = 0 turns the poly depletion model off.
Improved Mobility Model
The new equations for the improved mobility model are given in the coming sections.
Improved GIDL/GISL Model
For MTRLMOD=1, the flat band voltage at source/drain is given in the coming sections. New equations for the GIDL and GISL model are also given.
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