This topic provides a high-level overview of the new features in the IC23.1 release.
IC23.1 ISR1
Customize Fields in the Create S-Parameter View Form
You can customize the fields in the Create S-Parameter View Form using the exportCellName, exportLibName, and exportSparamViewName environment variables.
SVDB Directory Label
Modify the SVDB Directory label using the svdbDirectoryLabelText environment variable.
IC23.1 Base
Stacked Module Management
Stacked modules are the basic building blocks of modern micro-electronic systems. To achieve compaction, IC dies are stacked and bonded. Virtuoso Stacked Silicon Solution flow provides the required interface and options to design compact, stacked ICs.
Custom Passive Device Authoring Flow
To optimize custom devices (passive devices) that are not part of the foundry process, you need to create these devices manually in the layout as RFIC designers. The new Custom Passive Device Authoring flow lets you use EMX in full cellview mode to characterize a device, and create symbol and sparam views.
The Currents Assistant in the V3D Viewer
The New Currents assistant in the Virtuoso 3D Viewer lets you manage the visibility of the current flow through the 3D structure.
LVS-Based EMX Extraction
You can now use the LVS-based EMX integration in Virtuoso RF Solution. This flow uses only the signed-off LVS, which ensures full synchronization with the Smart Views generated by Pegasus™ Verification System and Quantus™ Extraction Solution.
Virtuoso Integrity 3D-IC Flow
In this new flow, an analog IC in Virtuoso is the starting point. The bump information is passed from Virtuoso through the Integrity™ hierarchical database (iHDB) to Integrity 3D-IC. Bumps are modified in Integrity 3D-IC and the modified bump information is passed back through iHDB to Virtuoso.
Creating a Packaging Bus
The Create Packaging Bus command lets you create packaging buses when using the Virtuoso RF Solution. The command supports area-based rules and the settings are controlled by using the new Create Packaging Bus form. See Snapping Behavior of Curved Paths Using Create Packaging Bus for more information.
