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Stacked Modules Management
Stacked modules are the basic building blocks of modern micro-electronic systems. Miniaturization of devices, for example cellular devices and medical devices, led to an increased demand for compact integrated circuit (IC) integration without any impact on device performance. To achieve compaction, IC dies are stacked and bonded. Stacking dies increases the available surface area on a package. Also, the electrical connections between stacked ICs are stronger than those on regular ICs.
A stacked module is a circuit that is integrated vertically with two or more dies that are stacked, aligned, and bonded using bumps. In conventional ICs, dies are connected using bumps or bonding pads on one side of the chip. In stacked modules, re-distributed layers (RDLs) are generated at the back of the chip. Bumps can be placed on both sides of the chip. Through-silicon vias (TSVs), through-package vias (TPVs), bumps, and silicon interposers help establish interconnections between dies.
Related Topics
Virtuoso Stacked Silicon Solution Flow
Virtuoso Stacked Silicon Solution Flow
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