Configuring a Module Stack

In a multi-chip module or stacked IC, to configure a module stack:

1. Click Module – Configure Module Stack to define the arrangement of dies. The Configure Module Stack form is displayed.
   The arrangement definition in the form includes the following information:
   • Type of dies - wirebonded or flipchip
   • Position of dies in the stack
   • Mirrored or not, that is, if they are placed at the front or at the rear side of an interposer
     
     
2. Select Flipped to specify whether a die is a flipchip.
3. Use the Order drop-down list to specify the order of a die or object in a stack.
4. Select Mirrored to specify whether a die is mirrored.
5. Click OK.

Related Topic

Package Layout Creation

Types of Bump Attachments

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