Movement of Die Instances in Edit-in-Concert Mode
Edit-in-Concert supports the following in-sync die movements:
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IO pad movement between board, package, and IC fabrics. The following images depict the synchronous movement of an IO pad in the die layout view and its corresponding package layout view Edit-in-Concert tabs:
Use the Edit - Hierarchy - Edit In Place command to edit placed instances that are located at lower levels. Using the Edit - Hierarchy - Descend command is not recommended.
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Ball grid array (BGA) and land grid array (LGA) IO movement between package footprint and package layout.
In the following example, a board design containing a package TILP instance and its corresponding package layout are open in Edit-in-Concert mode. An IO is moved in the package TILP instance. The corresponding IO in the package layout BGA instance is also moved.
Related Topics
- Modify in Edit-in-Concert Mode
- Movement of Dies in Edit-in-Concert Mode
- Changes to TILP Parameters in Edit-in-Concert mode
- Change from Package view to Layout View
- Net Tracing in Editing-In-Concert Mode
- Probing a Design in Edit-in-Concert Mode
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