Modify in Edit-in-Concert Mode

Edit-in-Concert supports dynamic modification of location and contents of the board, package, and IC dies. Therefore, these dies are always synchronized. Any modification you make to a die is auto-updated on the other tabs in the background. These modifications are immediately visible on all the relevant Edit-in-Concert tabs.

For example, when a bump cell containing bumps has been instantiated multiple times in a layout, moving a bump in Edit-in-Concert mode either at the top-level or level-1 results in the movement of the bump at multiple locations. The bump is moved at all locations in which the master bump cell has been instantiated.

The Virtuoso RF solution supports the following tasks in the Edit-in-Concert (in-sync) mode:

Zooming into dies
Move dies
Move die instances
Run cross-fabric check
Run cross-fabric net probe
Change TILP parameters
Run the Layout vs Abstract (LVS) checker and fixer
Run Net Tracer
Probe nets, bump instances, and Ball Grid Array (BGA) balls

Movement of Dies in Edit-in-Concert Mode

When you move a die in the package view, the die layout in the background is moved synchronously on the other tabs.

Similar synchronized movement is observed of package TILPs. When you move a package TILP, the position of the TILP is automatically updated in the background view of all the other tabs that are open in Edit-in-Concert mode.

In the following example, a package TILP is moved in the board die. Synchronous movement of the die is observed on the other tabs.

Virtuoso MultiTech Framework User Guide
Product Version IC23.1, November 2023