Product Documentation
Virtuoso RF Solution Guide
Product Version IC23.1, June 2023

Silicon Interposers

Silicon interposers are electrical routing channels that help establish much finer die-to-die interconnections, thereby increasing the performance and reducing the power consumption. Silicon interposers are dies that can include TSVs to provide connections from the upper metal layers to additional backside metal layers. Also, for minimizing differences in thermal expansion and contraction because the materials are similar.

Related Topics

Bumps (IO pads)

Through Silicon Vias (TSVs)

Padstacks

Stackup Information in Substrate

Wafer-Level Packaging


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