Die Operations
A stacked module comprises dies that are integrated vertically, aligned, and bonded using bumps. Bump management tasks are an integral part of the Virtuoso Stacked Silicon solution. Bump management tasks can be categorized into die operations and inter-die operations. Die operations are performed on individual dies and inter-die operations impact two or more dies.
In Virtuoso, bump management tasks can be run only when the design is open in Edit-In-Concert mode. In this mode, die commands are available from the tabs corresponding to individual dies and inter-die commands are available from the package or container tab.
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