Components of a Package

Virtuoso RF Solution is a complete physical design and manufacturing verification solution for complex Virtuoso-based package design, including die bump array/BGA integration refinement using die abstracts. It supports all the popular package interconnect and assembly methodologies and provides comprehensive constraint-driven layout of the package substrate.

This topic presents an overview of the component design and die-to-I/O routing. Design technology for packages varies. Depending on certain needs, substrates can be laminate-based (organic), ceramic, thin film (silicon), or a combination of materials. These needs may be based on cost, performance, signal, and thermal considerations.

Two important package components are, Land Grid Array (LGA) and BGA (Ball Grid Array). These are an array of chip connections, using surface-mount technology, in the form of solder balls.

Related Topics

Bumps (IO pads)

Through Silicon Vias (TSVs)

Silicon Interposers

Padstacks

Stackup Information in Substrate

Wafer-Level Packaging